Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

Abstract

Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and NSMD-NSMD is conducted through ABAQUS software and is applied with Anand model equation. The applied loading onto the test assembly is set with reflow cooling temperature of 220 °C to 25 °C. The purpose of this research is to obtain the package warpage, stress, and inelastic equivalent strain throughout the package and solder joints and to develop a predictive finite element model for mechanics and deformation of solder joint in BGA package under reflow cooling. The results obtained showed that solder joints with NSMD-NSMD pad geometry has a greater inelastic equivalent strain and has a greater potential in failing than SMD-NSMD pad geometry. Therefore, it can be concluded that SMD-NSMD pad geometry is more preferable for obtaining a more reliable solder joint.