Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

Authors

  • Lau Hong Ming Department of Mechanical Engineering, Faculty of Engineering and Science, Curtin University Malaysia
  • Sujan Debnath Department of Mechanical Engineering, Faculty of Engineering and Science, Curtin University Malaysia
  • Mahzan Johar Department of Mechanical Engineering, Faculty of Engineering and Science, Curtin University Malaysia
  • Siti Faizah Mad Asasaari School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
  • Mohd Al Fatihhi Szali Januddi Advanced Facilities Engineering Technology Research Cluster (AFET), Plant Engineering Tech-nology (PETech) Section, Malaysian Institute of Industrial Technology, Universiti Kuala Lum-pur, 81750 Masai, Johor, Malaysia
  • Mohamad Shahrul Effendy Kosnan Advanced Facilities Engineering Technology Research Cluster (AFET), Plant Engineering Tech-nology (PETech) Section, Malaysian Institute of Industrial Technology, Universiti Kuala Lum-pur, 81750 Masai, Johor, Malaysia

DOI:

https://doi.org/10.3991/ijoe.v18i08.31363

Keywords:

Ball grid array, SAC405 solders, reflow cooling, finite element simulation

Abstract


Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and NSMD-NSMD is conducted through ABAQUS software and is applied with Anand model equation. The applied loading onto the test assembly is set with reflow cooling temperature of 220 °C to 25 °C. The purpose of this research is to obtain the package warpage, stress, and inelastic equivalent strain throughout the package and solder joints and to develop a predictive finite element model for mechanics and deformation of solder joint in BGA package under reflow cooling. The results obtained showed that solder joints with NSMD-NSMD pad geometry has a greater inelastic equivalent strain and has a greater potential in failing than SMD-NSMD pad geometry. Therefore, it can be concluded that SMD-NSMD pad geometry is more preferable for obtaining a more reliable solder joint.

Covr iJOE Vol. 18 No. 08 (2022)

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Published

2022-06-28

How to Cite

Lau Hong Ming, Sujan Debnath, Mahzan Johar, Siti Faizah Mad Asasaari, Mohd Al Fatihhi Szali Januddi, & Mohamad Shahrul Effendy Kosnan. (2022). Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process. International Journal of Online and Biomedical Engineering (iJOE), 18(08), pp. 142–153. https://doi.org/10.3991/ijoe.v18i08.31363

Issue

Vol. 18 No. 08 (2022)

Section

Papers

License

Copyright (c) 2022 Lau Hong Ming, Sujan Debnath, Mahzan Johar, Siti Faizah Mad Asasaari , Mohd Al Fatihhi Szali Januddi , Mohamad Shahrul Effendy Kosnan

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