LAU HONG MING; SUJAN DEBNATH; MAHZAN JOHAR; SITI FAIZAH MAD ASASAARI; MOHD AL FATIHHI SZALI JANUDDI; MOHAMAD SHAHRUL EFFENDY KOSNAN. Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process. International Journal of Online and Biomedical Engineering (iJOE), [S. l.], v. 18, n. 08, p. pp. 142–153, 2022. DOI: 10.3991/ijoe.v18i08.31363. Disponível em: https://online-journals.org/index.php/i-joe/article/view/31363. Acesso em: 28 mar. 2024.