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Lau Hong Ming, Sujan Debnath, Mahzan Johar, Siti Faizah Mad Asasaari, Mohd Al Fatihhi Szali Januddi, Mohamad Shahrul Effendy Kosnan. Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process. Int. J. Onl. Eng. [Internet]. 2022 Jun. 28 [cited 2024 Mar. 29];18(08):pp. 142-153. Available from: https://online-journals.org/index.php/i-joe/article/view/31363